| 2025年中报 | 2024年年报 | 2024年中报 | 2023年年报 | 2023年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(元) | - | 1,046,930,700.00 | - | 1,451,524,800.00 | 894,949,109.62 |
| 300mm半导体硅片(元) | - | 2,105,856,300.00 | - | 1,378,571,600.00 | 639,247,200.68 |
| 受托加工(元) | 71,585,279.80 | 176,104,500.00 | 97,238,846.79 | 278,142,400.00 | - |
| 半导体硅片(元) | 1,611,251,029.07 | - | 1,432,035,919.53 | - | - |
| 其他(元) | 14,596,414.66 | - | 40,129,562.43 | - | - |
| 营业成本(元) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(元) | - | 1,194,476,600.00 | - | 1,201,482,900.00 | - |
| 300mm半导体硅片(元) | - | 2,312,277,700.00 | - | 1,234,455,000.00 | - |
| 受托加工(元) | 74,186,281.08 | 159,617,600.00 | 74,922,129.88 | 189,324,800.00 | - |
| 半导体硅片(元) | 1,838,706,473.41 | - | 1,646,766,440.77 | - | - |
| 其他(元) | 6,853,404.84 | - | 18,861,569.17 | - | - |
| 毛利(元) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(元) | - | -147,545,900.00 | - | 250,041,900.00 | - |
| 300mm半导体硅片(元) | - | -206,421,400.00 | - | 144,116,600.00 | - |
| 受托加工(元) | -2,601,001.28 | 16,486,900.00 | 22,316,716.91 | 88,817,600.00 | - |
| 半导体硅片(元) | -227,455,444.34 | - | -214,730,521.24 | - | - |
| 其他(元) | 7,743,009.82 | - | 21,267,993.26 | - | - |
| 毛利率(%) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(%) | - | -14.09 | - | 17.23 | - |
| 300mm半导体硅片(%) | - | -9.80 | - | 10.45 | - |
| 受托加工(%) | -3.63 | 9.36 | 22.95 | 31.93 | - |
| 半导体硅片(%) | -14.12 | - | -14.99 | - | - |
| 其他(%) | 53.05 | - | 53.00 | - | - |
| 收入构成(%) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(%) | - | 31.45 | - | 46.70 | 58.33 |
| 300mm半导体硅片(%) | - | 63.26 | - | 44.35 | 41.67 |
| 受托加工(%) | 4.22 | 5.29 | 6.20 | 8.95 | - |
| 半导体硅片(%) | 94.92 | - | 91.25 | - | - |
| 其他(%) | 0.86 | - | 2.56 | - | - |
| 毛利构成(%) | |||||
| 200mm及以下半导体硅片(含SOI硅片)(%) | - | - | - | 51.77 | - |
| 300mm半导体硅片(%) | - | - | - | 29.84 | - |
| 受托加工(%) | - | - | - | 18.39 | - |
| 半导体硅片(%) | - | - | - | - | - |
| 其他(%) | - | - | - | - | - |