| 2025年中报 | 2024年年报 | 2024年中报 | 2023年年报 | 2023年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 半导体封装模具(元) | 6,946,144.77 | 15,138,704.47 | 4,437,287.61 | 10,120,975.89 | 6,331,655.73 |
| 半导体封装设备(元) | 37,832,477.87 | 85,574,454.88 | 31,816,814.15 | 40,828,948.53 | 18,446,009.75 |
| 塑料挤出成型模具、挤出成型装置(元) | 90,827,192.41 | - | 67,893,571.04 | - | 56,681,732.36 |
| 塑料挤出成型下游设备(元) | 800,262.99 | - | 2,340,563.13 | - | 5,219,684.99 |
| 挤出成型装置及下游设备(元) | - | 8,696,796.09 | - | 18,000,672.93 | - |
| 塑料挤出成型模具(元) | - | 154,211,147.48 | - | 123,640,557.46 | - |
| 其他(元) | 1,345,363.22 | 1,561,773.19 | 521,873.50 | 1,576,316.34 | 487,473.56 |
| 营业成本(元) | |||||
| 半导体封装模具(元) | 3,903,631.87 | 10,413,456.32 | 2,863,724.51 | 6,157,482.49 | - |
| 半导体封装设备(元) | 27,932,363.54 | 62,632,881.02 | 18,060,334.73 | 30,717,611.35 | - |
| 塑料挤出成型模具、挤出成型装置(元) | 44,991,217.80 | - | 37,441,714.72 | - | - |
| 塑料挤出成型下游设备(元) | 386,147.99 | - | 1,309,515.51 | - | - |
| 挤出成型装置及下游设备(元) | - | 5,191,634.77 | - | 10,031,740.06 | - |
| 塑料挤出成型模具(元) | - | 85,976,816.95 | - | 67,308,402.54 | - |
| 其他(元) | 704,654.80 | 783,553.98 | 217,069.51 | 792,029.73 | - |
| 毛利(元) | |||||
| 半导体封装模具(元) | 3,042,512.90 | 4,725,248.15 | 1,573,563.10 | 3,963,493.40 | - |
| 半导体封装设备(元) | 9,900,114.33 | 22,941,573.86 | 13,756,479.42 | 10,111,337.18 | - |
| 塑料挤出成型模具、挤出成型装置(元) | 45,835,974.61 | - | 30,451,856.32 | - | - |
| 塑料挤出成型下游设备(元) | 414,115.00 | - | 1,031,047.62 | - | - |
| 挤出成型装置及下游设备(元) | - | 3,505,161.32 | - | 7,968,932.87 | - |
| 塑料挤出成型模具(元) | - | 68,234,330.53 | - | 56,332,154.92 | - |
| 其他(元) | 640,708.42 | 778,219.21 | 304,803.99 | 784,286.61 | - |
| 毛利率(%) | |||||
| 半导体封装模具(%) | 43.80 | 31.21 | 35.46 | 39.16 | - |
| 半导体封装设备(%) | 26.17 | 26.81 | 43.24 | 24.77 | - |
| 塑料挤出成型模具、挤出成型装置(%) | 50.47 | - | 44.85 | - | - |
| 塑料挤出成型下游设备(%) | 51.75 | - | 44.05 | - | - |
| 挤出成型装置及下游设备(%) | - | 40.30 | - | 44.27 | - |
| 塑料挤出成型模具(%) | - | 44.25 | - | 45.56 | - |
| 其他(%) | 47.62 | 49.83 | 58.41 | 49.75 | - |
| 收入构成(%) | |||||
| 半导体封装模具(%) | 5.04 | 5.71 | 4.15 | 5.21 | 7.26 |
| 半导体封装设备(%) | 27.46 | 32.27 | 29.73 | 21.03 | 21.16 |
| 塑料挤出成型模具、挤出成型装置(%) | 65.94 | - | 63.45 | - | 65.03 |
| 塑料挤出成型下游设备(%) | 0.58 | - | 2.19 | - | 5.99 |
| 挤出成型装置及下游设备(%) | - | 3.28 | - | 9.27 | - |
| 塑料挤出成型模具(%) | - | 58.15 | - | 63.68 | - |
| 其他(%) | 0.98 | 0.59 | 0.49 | 0.81 | 0.56 |
| 毛利构成(%) | |||||
| 半导体封装模具(%) | 5.08 | 4.72 | 3.34 | 5.01 | - |
| 半导体封装设备(%) | 16.55 | 22.90 | 29.20 | 12.77 | - |
| 塑料挤出成型模具、挤出成型装置(%) | 76.61 | - | 64.63 | - | - |
| 塑料挤出成型下游设备(%) | 0.69 | - | 2.19 | - | - |
| 挤出成型装置及下游设备(%) | - | 3.50 | - | 10.07 | - |
| 塑料挤出成型模具(%) | - | 68.11 | - | 71.16 | - |
| 其他(%) | 1.07 | 0.78 | 0.65 | 0.99 | - |