| 2025年中报 | 2024年年报 | 2024年中报 | 2023年年报 | 2023年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 集成电路封装测试(元) | - | - | - | - | 977,230,003.01 |
| 扁平无引脚封装产品(元) | 759,670,418.59 | 1,261,577,693.53 | 509,922,513.59 | 748,465,751.23 | - |
| 高密度细间距凸点倒装产品(FC类产品)(元) | 294,956,262.94 | 569,789,825.93 | 271,253,429.05 | 365,649,408.14 | - |
| 微机电系统传感器(元) | - | - | - | 2,806,351.76 | - |
| 系统级封装产品(元) | 827,522,279.61 | 1,589,744,054.54 | 786,596,567.22 | 1,248,801,006.17 | - |
| 晶圆级封测产品(元) | 85,281,920.53 | 106,113,574.89 | 34,003,818.51 | - | - |
| 其他产品(元) | 10,413,378.79 | 8,481,735.60 | 2,054,714.91 | 16,571,708.04 | - |
| 其他收入(元) | 28,250,268.07 | - | - | - | - |
| 营业成本(元) | |||||
| 集成电路封装测试(元) | - | - | - | - | 858,539,416.80 |
| 扁平无引脚封装产品(元) | 649,227,358.76 | 1,089,992,583.97 | 453,483,100.44 | 709,074,491.12 | - |
| 高密度细间距凸点倒装产品(FC类产品)(元) | 252,985,685.05 | 467,424,932.58 | 213,931,551.04 | 286,880,606.48 | - |
| 微机电系统传感器(元) | - | - | - | 2,522,152.37 | - |
| 系统级封装产品(元) | 674,499,948.01 | 1,228,849,649.71 | 592,739,639.69 | 1,008,700,410.49 | - |
| 晶圆级封测产品(元) | 101,263,737.67 | 155,689,760.42 | 64,988,882.98 | - | - |
| 其他产品(元) | 11,767,474.28 | 8,406,278.17 | 2,473,080.04 | 42,238,017.08 | - |
| 其他收入(元) | 4,931,267.58 | - | - | - | - |
| 毛利(元) | |||||
| 集成电路封装测试(元) | - | - | - | - | 118,690,586.21 |
| 扁平无引脚封装产品(元) | 110,443,059.83 | 171,585,109.56 | 56,439,413.15 | 39,391,260.11 | - |
| 高密度细间距凸点倒装产品(FC类产品)(元) | 41,970,577.89 | 102,364,893.35 | 57,321,878.01 | 78,768,801.66 | - |
| 微机电系统传感器(元) | - | - | - | 284,199.39 | - |
| 系统级封装产品(元) | 153,022,331.60 | 360,894,404.83 | 193,856,927.53 | 240,100,595.68 | - |
| 晶圆级封测产品(元) | -15,981,817.14 | -49,576,185.53 | -30,985,064.47 | - | - |
| 其他产品(元) | -1,354,095.49 | 75,457.43 | -418,365.13 | -25,666,309.04 | - |
| 其他收入(元) | 23,319,000.49 | - | - | - | - |
| 毛利率(%) | |||||
| 集成电路封装测试(%) | - | - | - | - | 12.15 |
| 扁平无引脚封装产品(%) | 14.54 | 13.60 | 11.07 | 5.26 | - |
| 高密度细间距凸点倒装产品(FC类产品)(%) | 14.23 | 17.97 | 21.13 | 21.54 | - |
| 微机电系统传感器(%) | - | - | - | 10.13 | - |
| 系统级封装产品(%) | 18.49 | 22.70 | 24.65 | 19.23 | - |
| 晶圆级封测产品(%) | -18.74 | -46.72 | -91.12 | - | - |
| 其他产品(%) | -13.00 | 0.89 | -20.36 | -154.88 | - |
| 其他收入(%) | 82.54 | - | - | - | - |
| 收入构成(%) | |||||
| 集成电路封装测试(%) | - | - | - | - | 100.00 |
| 扁平无引脚封装产品(%) | 37.87 | 35.68 | 31.79 | 31.42 | - |
| 高密度细间距凸点倒装产品(FC类产品)(%) | 14.70 | 16.12 | 16.91 | 15.35 | - |
| 微机电系统传感器(%) | - | - | - | 0.12 | - |
| 系统级封装产品(%) | 41.25 | 44.96 | 49.04 | 52.42 | - |
| 晶圆级封测产品(%) | 4.25 | 3.00 | 2.12 | - | - |
| 其他产品(%) | 0.52 | 0.24 | 0.13 | 0.70 | - |
| 其他收入(%) | 1.41 | - | - | - | - |
| 毛利构成(%) | |||||
| 集成电路封装测试(%) | - | - | - | - | 100.00 |
| 扁平无引脚封装产品(%) | 35.46 | 29.31 | 20.43 | 11.83 | - |
| 高密度细间距凸点倒装产品(FC类产品)(%) | 13.48 | 17.49 | 20.75 | 23.66 | - |
| 微机电系统传感器(%) | - | - | - | 0.09 | - |
| 系统级封装产品(%) | 49.14 | 61.66 | 70.18 | 72.13 | - |
| 晶圆级封测产品(%) | -5.13 | -8.47 | -11.22 | - | - |
| 其他产品(%) | -0.43 | 0.01 | -0.15 | -7.71 | - |
| 其他收入(%) | 7.49 | - | - | - | - |