| 2026年中报 | 2025年年报 | 2025年中报 | 2024年年报 | |
|---|---|---|---|---|
| 营业收入(元) | ||||
| 晶圆级封装(元) | 435,813,479.00 | 977,838,870.24 | 394,040,609.78 | 849,006,205.42 |
| 芯粒多芯片集成封装(元) | 1,828,089,055.74 | 3,328,047,041.31 | 1,781,642,098.85 | 2,078,790,862.18 |
| 中段硅片加工(元) | 1,126,643,309.98 | 2,182,412,349.92 | 992,237,261.61 | 1,754,845,957.17 |
| 营业成本(元) | ||||
| 晶圆级封装(元) | 386,441,791.32 | 821,366,441.78 | 371,627,472.59 | 795,460,734.74 |
| 芯粒多芯片集成封装(元) | 1,263,891,028.40 | 2,371,986,340.65 | 1,235,853,136.30 | 1,667,918,364.34 |
| 中段硅片加工(元) | 727,634,324.94 | 1,296,874,368.63 | 558,054,999.61 | 1,128,310,546.44 |
| 毛利(元) | ||||
| 晶圆级封装(元) | 49,371,687.68 | 156,472,428.46 | 22,413,137.19 | 53,545,470.68 |
| 芯粒多芯片集成封装(元) | 564,198,027.34 | 956,060,700.66 | 545,788,962.55 | 410,872,497.84 |
| 中段硅片加工(元) | 399,008,985.04 | 885,537,981.29 | 434,182,262.00 | 626,535,410.73 |
| 毛利率(%) | ||||
| 晶圆级封装(%) | 11.33 | 16.00 | 5.69 | 6.31 |
| 芯粒多芯片集成封装(%) | 30.86 | 28.73 | 30.63 | 19.76 |
| 中段硅片加工(%) | 35.42 | 40.58 | 43.76 | 35.70 |
| 收入构成(%) | ||||
| 晶圆级封装(%) | 12.85 | 15.07 | 12.44 | 18.13 |
| 芯粒多芯片集成封装(%) | 53.92 | 51.29 | 56.24 | 44.39 |
| 中段硅片加工(%) | 33.23 | 33.64 | 31.32 | 37.48 |
| 毛利构成(%) | ||||
| 晶圆级封装(%) | 4.88 | 7.83 | 2.24 | 4.91 |
| 芯粒多芯片集成封装(%) | 55.72 | 47.85 | 54.45 | 37.66 |
| 中段硅片加工(%) | 39.41 | 44.32 | 43.31 | 57.43 |