| 2024年中报 | 2023年年报 | 2023年中报 | 2022年年报 | 2022年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| IC设计(元) | - | - | - | - | 614,765,454.48 |
| 封装测试(元) | - | - | - | - | 828,860,608.59 |
| 晶圆制造(元) | - | - | - | - | 1,565,693,552.49 |
| 配套支持(元) | - | - | - | - | 203,913,625.16 |
| 分立器件(元) | - | - | - | - | 1,866,270,616.52 |
| 产品与方案(元) | 2,341,777,578.79 | 4,669,600,100.79 | 2,394,567,178.32 | 4,947,491,919.92 | - |
| 制造及服务(元) | 2,298,850,584.39 | 5,080,125,376.80 | 2,545,549,978.24 | 4,948,591,813.17 | - |
| 营业成本(元) | |||||
| IC设计(元) | - | - | - | - | - |
| 封装测试(元) | - | - | - | - | - |
| 晶圆制造(元) | - | - | - | - | - |
| 配套支持(元) | - | - | - | - | - |
| 分立器件(元) | - | - | - | - | - |
| 产品与方案(元) | 1,880,435,625.10 | 3,426,523,106.20 | - | 3,160,059,806.30 | - |
| 制造及服务(元) | 1,519,466,201.44 | 3,178,975,190.16 | - | 3,087,211,343.29 | - |
| 毛利(元) | |||||
| IC设计(元) | - | - | - | - | - |
| 封装测试(元) | - | - | - | - | - |
| 晶圆制造(元) | - | - | - | - | - |
| 配套支持(元) | - | - | - | - | - |
| 分立器件(元) | - | - | - | - | - |
| 产品与方案(元) | 461,341,953.69 | 1,243,076,994.59 | - | 1,787,432,113.62 | - |
| 制造及服务(元) | 779,384,382.95 | 1,901,150,186.64 | - | 1,861,380,469.88 | - |
| 毛利率(%) | |||||
| IC设计(%) | - | - | - | - | - |
| 封装测试(%) | - | - | - | - | - |
| 晶圆制造(%) | - | - | - | - | - |
| 配套支持(%) | - | - | - | - | - |
| 分立器件(%) | - | - | - | - | - |
| 产品与方案(%) | 19.70 | 26.62 | - | 36.13 | - |
| 制造及服务(%) | 33.90 | 37.42 | - | 37.61 | - |
| 收入构成(%) | |||||
| IC设计(%) | - | - | - | - | 12.10 |
| 封装测试(%) | - | - | - | - | 16.32 |
| 晶圆制造(%) | - | - | - | - | 30.82 |
| 配套支持(%) | - | - | - | - | 4.01 |
| 分立器件(%) | - | - | - | - | 36.74 |
| 产品与方案(%) | 50.46 | 47.89 | 48.47 | 49.99 | - |
| 制造及服务(%) | 49.54 | 52.11 | 51.53 | 50.01 | - |
| 毛利构成(%) | |||||
| IC设计(%) | - | - | - | - | - |
| 封装测试(%) | - | - | - | - | - |
| 晶圆制造(%) | - | - | - | - | - |
| 配套支持(%) | - | - | - | - | - |
| 分立器件(%) | - | - | - | - | - |
| 产品与方案(%) | 37.18 | 39.54 | - | 48.99 | - |
| 制造及服务(%) | 62.82 | 60.46 | - | 51.01 | - |