| 2025年中报 | 2024年年报 | 2024年中报 | 2023年年报 | 2023年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 通信材料(元) | 66,649,492.50 | 187,551,609.43 | 95,907,804.00 | 215,342,877.92 | 107,171,778.24 |
| 引线框架(元) | - | 50,930,988.49 | - | 41,187,202.59 | 17,523,121.81 |
| 半导体封装材料(元) | 24,719,280.22 | - | 25,654,106.19 | - | - |
| 其他(元) | 5,848,836.16 | 36,895,142.78 | 11,374,539.48 | 21,514,286.92 | - |
| 营业成本(元) | |||||
| 通信材料(元) | 55,595,639.26 | 140,553,163.57 | 71,261,227.85 | 156,899,725.58 | 76,637,152.36 |
| 引线框架(元) | - | 47,531,237.94 | - | 40,135,928.43 | 17,101,876.20 |
| 半导体封装材料(元) | 24,103,283.00 | - | 23,351,037.63 | - | - |
| 其他(元) | 2,667,277.38 | 22,822,011.18 | 4,232,912.23 | 4,021,564.78 | - |
| 毛利(元) | |||||
| 通信材料(元) | 11,053,853.24 | 46,998,445.86 | 24,646,576.15 | 58,443,152.34 | 30,534,625.88 |
| 引线框架(元) | - | 3,399,750.55 | - | 1,051,274.16 | 421,245.61 |
| 半导体封装材料(元) | 615,997.22 | - | 2,303,068.56 | - | - |
| 其他(元) | 3,181,558.78 | 14,073,131.60 | 7,141,627.25 | 17,492,722.14 | - |
| 毛利率(%) | |||||
| 通信材料(%) | 16.59 | 25.06 | 25.70 | 27.14 | 28.49 |
| 引线框架(%) | - | 6.68 | - | 2.55 | 2.40 |
| 半导体封装材料(%) | 2.49 | - | 8.98 | - | - |
| 其他(%) | 54.40 | 38.14 | 62.79 | 81.31 | - |
| 收入构成(%) | |||||
| 通信材料(%) | 68.56 | 68.11 | 72.15 | 77.45 | 85.95 |
| 引线框架(%) | - | 18.49 | - | 14.81 | 14.05 |
| 半导体封装材料(%) | 25.43 | - | 19.30 | - | - |
| 其他(%) | 6.02 | 13.40 | 8.56 | 7.74 | - |
| 毛利构成(%) | |||||
| 通信材料(%) | 74.43 | 72.90 | 72.30 | 75.91 | 98.64 |
| 引线框架(%) | - | 5.27 | - | 1.37 | 1.36 |
| 半导体封装材料(%) | 4.15 | - | 6.76 | - | - |
| 其他(%) | 21.42 | 21.83 | 20.95 | 22.72 | - |