| 2026年中报 | 2025年年报 | 2025年中报 | 2024年年报 | 2024年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 半导体封装浆料(元) | - | - | 11,541,866.58 | 14,112,690.33 | 6,591,813.70 |
| 材料销售(元) | 29,665,262.18 | 2,356,961,888.02 | 1,777,293,354.46 | 2,148,781,806.02 | 668,599,198.42 |
| 光伏导电银浆(元) | - | - | 6,242,903,748.27 | 12,864,827,112.02 | 6,764,222,678.05 |
| 存储芯片(元) | 357,686,916.78 | 502,900,618.16 | 188,715,260.28 | 74,544,499.06 | - |
| 电子材料(元) | 28,619,629.15 | 30,463,820.65 | - | - | - |
| 光伏材料(元) | 11,156,827,364.97 | 14,866,489,131.80 | - | - | - |
| 其他(元) | 91,507,005.03 | 289,313,917.94 | 119,487,852.66 | 248,305,439.30 | 147,258,779.57 |
| 营业成本(元) | |||||
| 半导体封装浆料(元) | - | - | 14,005,769.55 | - | 7,932,122.12 |
| 材料销售(元) | 39,296,691.90 | 2,291,408,191.61 | 1,730,312,707.34 | 2,115,294,800.68 | 655,927,395.78 |
| 光伏导电银浆(元) | - | - | 5,698,168,592.06 | 11,498,527,520.71 | 5,965,277,233.20 |
| 存储芯片(元) | 127,725,816.96 | 264,205,716.26 | 141,727,289.23 | - | - |
| 电子材料(元) | 26,649,324.01 | 34,915,095.01 | - | - | - |
| 光伏材料(元) | 10,427,665,035.82 | 13,592,539,719.66 | - | - | - |
| 其他(元) | 32,642,948.88 | 222,911,966.28 | 100,441,239.90 | - | 136,154,112.73 |
| 毛利(元) | |||||
| 半导体封装浆料(元) | - | - | -2,463,902.97 | - | -1,340,308.42 |
| 材料销售(元) | -9,631,429.72 | 65,553,696.41 | 46,980,647.12 | 33,487,005.34 | 12,671,802.64 |
| 光伏导电银浆(元) | - | - | 544,735,156.21 | 1,366,299,591.31 | 798,945,444.85 |
| 存储芯片(元) | 229,961,099.82 | 238,694,901.90 | 46,987,971.05 | - | - |
| 电子材料(元) | 1,970,305.14 | -4,451,274.36 | - | - | - |
| 光伏材料(元) | 729,162,329.15 | 1,273,949,412.14 | - | - | - |
| 其他(元) | 58,864,056.15 | 66,401,951.66 | 19,046,612.76 | - | 11,104,666.84 |
| 毛利率(%) | |||||
| 半导体封装浆料(%) | - | - | -21.35 | - | -20.33 |
| 材料销售(%) | -32.47 | 2.78 | 2.64 | 1.56 | 1.90 |
| 光伏导电银浆(%) | - | - | 8.73 | 10.62 | 11.81 |
| 存储芯片(%) | 64.29 | 47.46 | 24.90 | - | - |
| 电子材料(%) | 6.88 | -14.61 | - | - | - |
| 光伏材料(%) | 6.54 | 8.57 | - | - | - |
| 其他(%) | 64.33 | 22.95 | 15.94 | - | 7.54 |
| 收入构成(%) | |||||
| 半导体封装浆料(%) | - | - | 0.14 | 0.09 | 0.09 |
| 材料销售(%) | 0.25 | 13.06 | 21.31 | 14.00 | 8.81 |
| 光伏导电银浆(%) | - | - | 74.86 | 83.81 | 89.16 |
| 存储芯片(%) | 3.07 | 2.79 | 2.26 | 0.49 | - |
| 电子材料(%) | 0.25 | 0.17 | - | - | - |
| 光伏材料(%) | 95.65 | 82.38 | - | - | - |
| 其他(%) | 0.78 | 1.60 | 1.43 | 1.62 | 1.94 |
| 毛利构成(%) | |||||
| 半导体封装浆料(%) | - | - | -0.38 | 0.00 | -0.16 |
| 材料销售(%) | -0.95 | 4.00 | 7.17 | 2.39 | 1.54 |
| 光伏导电银浆(%) | - | - | 83.13 | 97.61 | 97.27 |
| 存储芯片(%) | 22.76 | 14.55 | 7.17 | 0.00 | - |
| 电子材料(%) | 0.20 | -0.27 | - | - | - |
| 光伏材料(%) | 72.17 | 77.67 | - | - | - |
| 其他(%) | 5.83 | 4.05 | 2.91 | 0.00 | 1.35 |