| 2026年中报 | 2025年年报 | 2025年中报 | 2024年年报 | 2024年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 电容(元) | - | - | - | 211,771,150.37 | 104,095,170.44 |
| 定制和自研芯片(元) | - | 208,282,723.66 | - | 176,233,598.50 | 77,967,410.24 |
| 分立器件(元) | - | - | - | 394,368,256.95 | 179,933,774.14 |
| 连接器(元) | - | - | - | 41,156,317.35 | 17,636,782.01 |
| 射频及功率放大器件(元) | - | - | - | 361,955,409.42 | 173,420,224.59 |
| 数字通讯芯片及系统级应用产品(元) | - | - | - | 516,441,123.33 | 219,114,128.73 |
| 物联网无线通讯模块(元) | - | 265,969,857.71 | - | 282,829,142.02 | 161,216,619.24 |
| 音频及功率放大器件(元) | - | - | - | 417,610,424.79 | 147,205,843.64 |
| IC及其他电子元器件(元) | 1,382,507,275.00 | - | 1,358,155,038.60 | - | - |
| 分立与电源器件(元) | - | 544,529,743.18 | - | - | - |
| 基础电子元器件(元) | - | 270,996,995.29 | - | - | - |
| 射频前端及功率器件(元) | - | 346,381,450.81 | - | - | - |
| 无线连接芯片与系统方案(元) | - | 623,607,335.08 | - | - | - |
| 智能音频及声学器件(元) | - | 412,664,452.03 | - | - | - |
| 其他(元) | - | 215,545,757.34 | - | 193,504,284.45 | 86,047,503.94 |
| 营业成本(元) | |||||
| 电容(元) | - | - | - | 182,259,883.65 | - |
| 定制和自研芯片(元) | - | 185,373,384.19 | - | 159,344,096.88 | - |
| 分立器件(元) | - | - | - | 348,409,789.11 | 158,407,631.66 |
| 连接器(元) | - | - | - | 35,109,732.03 | - |
| 射频及功率放大器件(元) | - | - | - | 329,682,454.25 | 159,144,295.25 |
| 数字通讯芯片及系统级应用产品(元) | - | - | - | 485,368,297.08 | 205,407,426.20 |
| 物联网无线通讯模块(元) | - | 250,341,786.59 | - | 266,979,776.36 | 149,542,245.58 |
| 音频及功率放大器件(元) | - | - | - | 398,513,580.45 | 140,558,848.11 |
| IC及其他电子元器件(元) | 1,250,005,052.21 | - | 1,223,491,631.45 | - | - |
| 分立与电源器件(元) | - | 486,659,657.53 | - | - | - |
| 基础电子元器件(元) | - | 231,765,625.06 | - | - | - |
| 射频前端及功率器件(元) | - | 307,030,968.89 | - | - | - |
| 无线连接芯片与系统方案(元) | - | 594,922,516.85 | - | - | - |
| 智能音频及声学器件(元) | - | 392,328,280.39 | - | - | - |
| 其他(元) | - | 170,661,297.30 | - | 153,135,958.85 | - |
| 毛利(元) | |||||
| 电容(元) | - | - | - | 29,511,266.72 | - |
| 定制和自研芯片(元) | - | 22,909,339.47 | - | 16,889,501.62 | - |
| 分立器件(元) | - | - | - | 45,958,467.84 | 21,526,142.48 |
| 连接器(元) | - | - | - | 6,046,585.32 | - |
| 射频及功率放大器件(元) | - | - | - | 32,272,955.17 | 14,275,929.34 |
| 数字通讯芯片及系统级应用产品(元) | - | - | - | 31,072,826.25 | 13,706,702.53 |
| 物联网无线通讯模块(元) | - | 15,628,071.12 | - | 15,849,365.66 | 11,674,373.66 |
| 音频及功率放大器件(元) | - | - | - | 19,096,844.34 | 6,646,995.53 |
| IC及其他电子元器件(元) | 132,502,222.79 | - | 134,663,407.15 | - | - |
| 分立与电源器件(元) | - | 57,870,085.65 | - | - | - |
| 基础电子元器件(元) | - | 39,231,370.23 | - | - | - |
| 射频前端及功率器件(元) | - | 39,350,481.92 | - | - | - |
| 无线连接芯片与系统方案(元) | - | 28,684,818.23 | - | - | - |
| 智能音频及声学器件(元) | - | 20,336,171.64 | - | - | - |
| 其他(元) | - | 44,884,460.04 | - | 40,368,325.60 | - |
| 毛利率(%) | |||||
| 电容(%) | - | - | - | 13.94 | - |
| 定制和自研芯片(%) | - | 11.00 | - | 9.58 | - |
| 分立器件(%) | - | - | - | 11.65 | 11.96 |
| 连接器(%) | - | - | - | 14.69 | - |
| 射频及功率放大器件(%) | - | - | - | 8.92 | 8.23 |
| 数字通讯芯片及系统级应用产品(%) | - | - | - | 6.02 | 6.26 |
| 物联网无线通讯模块(%) | - | 5.88 | - | 5.60 | 7.24 |
| 音频及功率放大器件(%) | - | - | - | 4.57 | 4.52 |
| IC及其他电子元器件(%) | 9.58 | - | 9.92 | - | - |
| 分立与电源器件(%) | - | 10.63 | - | - | - |
| 基础电子元器件(%) | - | 14.48 | - | - | - |
| 射频前端及功率器件(%) | - | 11.36 | - | - | - |
| 无线连接芯片与系统方案(%) | - | 4.60 | - | - | - |
| 智能音频及声学器件(%) | - | 4.93 | - | - | - |
| 其他(%) | - | 20.82 | - | 20.86 | - |
| 收入构成(%) | |||||
| 电容(%) | - | - | - | 8.16 | 8.92 |
| 定制和自研芯片(%) | - | 7.21 | - | 6.79 | 6.68 |
| 分立器件(%) | - | - | - | 15.19 | 15.42 |
| 连接器(%) | - | - | - | 1.59 | 1.51 |
| 射频及功率放大器件(%) | - | - | - | 13.94 | 14.86 |
| 数字通讯芯片及系统级应用产品(%) | - | - | - | 19.89 | 18.78 |
| 物联网无线通讯模块(%) | - | 9.21 | - | 10.90 | 13.82 |
| 音频及功率放大器件(%) | - | - | - | 16.09 | 12.62 |
| IC及其他电子元器件(%) | 100.00 | - | 100.00 | - | - |
| 分立与电源器件(%) | - | 18.86 | - | - | - |
| 基础电子元器件(%) | - | 9.38 | - | - | - |
| 射频前端及功率器件(%) | - | 11.99 | - | - | - |
| 无线连接芯片与系统方案(%) | - | 21.59 | - | - | - |
| 智能音频及声学器件(%) | - | 14.29 | - | - | - |
| 其他(%) | - | 7.46 | - | 7.45 | 7.38 |
| 毛利构成(%) | |||||
| 电容(%) | - | - | - | 12.45 | 0.00 |
| 定制和自研芯片(%) | - | 8.52 | - | 7.12 | 0.00 |
| 分立器件(%) | - | - | - | 19.39 | 31.74 |
| 连接器(%) | - | - | - | 2.55 | 0.00 |
| 射频及功率放大器件(%) | - | - | - | 13.61 | 21.05 |
| 数字通讯芯片及系统级应用产品(%) | - | - | - | 13.11 | 20.21 |
| 物联网无线通讯模块(%) | - | 5.81 | - | 6.69 | 17.21 |
| 音频及功率放大器件(%) | - | - | - | 8.06 | 9.80 |
| IC及其他电子元器件(%) | 100.00 | - | 100.00 | - | - |
| 分立与电源器件(%) | - | 21.52 | - | - | - |
| 基础电子元器件(%) | - | 14.59 | - | - | - |
| 射频前端及功率器件(%) | - | 14.63 | - | - | - |
| 无线连接芯片与系统方案(%) | - | 10.67 | - | - | - |
| 智能音频及声学器件(%) | - | 7.56 | - | - | - |
| 其他(%) | - | 16.69 | - | 17.03 | 0.00 |