| 2026年中报 | 2025年年报 | 2025年中报 | 2024年年报 | 2024年中报 | |
|---|---|---|---|---|---|
| 营业收入(元) | |||||
| 半导体工艺材料(元) | - | - | - | - | 439,108,386.43 |
| 半导体工艺材料配套设备(元) | - | - | - | - | 24,321,221.26 |
| 涂料品(元) | 207,498,600.25 | 419,834,506.00 | 187,028,756.38 | 439,780,344.69 | 197,467,897.37 |
| 集成电路材料(元) | 994,661,398.22 | 1,478,602,813.30 | 683,874,144.80 | 998,060,279.30 | - |
| 集成电路材料配套设备及配件(元) | 44,256,280.81 | 34,245,388.84 | 24,788,412.40 | 30,375,184.75 | - |
| 集成电路电镀加工(元) | 15,679,576.02 | - | - | - | - |
| 内部抵消(元) | -67,002,711.72 | - | - | - | - |
| 营业成本(元) | |||||
| 半导体工艺材料(元) | - | - | - | - | 227,211,398.49 |
| 半导体工艺材料配套设备(元) | - | - | - | - | 16,161,891.42 |
| 涂料品(元) | 168,361,482.25 | 321,747,600.02 | 144,045,797.39 | 338,371,576.12 | 155,498,452.21 |
| 集成电路材料(元) | 535,076,746.29 | 794,042,508.03 | 369,985,632.12 | 537,017,206.36 | - |
| 集成电路材料配套设备及配件(元) | 38,876,132.20 | 25,358,830.37 | 17,208,466.93 | 18,606,648.69 | - |
| 集成电路电镀加工(元) | 16,230,126.06 | - | - | - | - |
| 内部抵消(元) | -67,156,626.59 | - | - | - | - |
| 毛利(元) | |||||
| 半导体工艺材料(元) | - | - | - | - | 211,896,987.94 |
| 半导体工艺材料配套设备(元) | - | - | - | - | 8,159,329.84 |
| 涂料品(元) | 39,137,118.00 | 98,086,905.98 | 42,982,958.99 | 101,408,768.57 | 41,969,445.16 |
| 集成电路材料(元) | 459,584,651.93 | 684,560,305.27 | 313,888,512.68 | 461,043,072.94 | - |
| 集成电路材料配套设备及配件(元) | 5,380,148.61 | 8,886,558.47 | 7,579,945.47 | 11,768,536.06 | - |
| 集成电路电镀加工(元) | -550,550.04 | - | - | - | - |
| 内部抵消(元) | 153,914.87 | - | - | - | - |
| 毛利率(%) | |||||
| 半导体工艺材料(%) | - | - | - | - | 48.26 |
| 半导体工艺材料配套设备(%) | - | - | - | - | 33.55 |
| 涂料品(%) | 18.86 | 23.36 | 22.98 | 23.06 | 21.25 |
| 集成电路材料(%) | 46.21 | 46.30 | 45.90 | 46.19 | - |
| 集成电路材料配套设备及配件(%) | 12.16 | 25.95 | 30.58 | 38.74 | - |
| 集成电路电镀加工(%) | -3.51 | - | - | - | - |
| 内部抵消(%) | -0.23 | - | - | - | - |
| 收入构成(%) | |||||
| 半导体工艺材料(%) | - | - | - | - | 66.44 |
| 半导体工艺材料配套设备(%) | - | - | - | - | 3.68 |
| 涂料品(%) | 17.36 | 21.72 | 20.88 | 29.95 | 29.88 |
| 集成电路材料(%) | 83.23 | 76.51 | 76.35 | 67.98 | - |
| 集成电路材料配套设备及配件(%) | 3.70 | 1.77 | 2.77 | 2.07 | - |
| 集成电路电镀加工(%) | 1.31 | - | - | - | - |
| 内部抵消(%) | -5.61 | - | - | - | - |
| 毛利构成(%) | |||||
| 半导体工艺材料(%) | - | - | - | - | 80.87 |
| 半导体工艺材料配套设备(%) | - | - | - | - | 3.11 |
| 涂料品(%) | 7.77 | 12.39 | 11.79 | 17.66 | 16.02 |
| 集成电路材料(%) | 91.24 | 86.49 | 86.13 | 80.29 | - |
| 集成电路材料配套设备及配件(%) | 1.07 | 1.12 | 2.08 | 2.05 | - |
| 集成电路电镀加工(%) | -0.11 | - | - | - | - |
| 内部抵消(%) | 0.03 | - | - | - | - |